HonWay is participating in the exhibition! Make an appointment first and get a free bottle of Mo C,More C natural lemon multi-purpose cleaning liquid---------
HonWay is participating in the exhibition! Make an appointment first and get a free bottle of Mo C,More C natural lemon multi-purpose cleaning liquid---------
HonWay is participating in the exhibition! Make an appointment first and get a free bottle of Mo C,More C natural lemon multi-purpose cleaning liquid---------
HonWay is participating in the exhibition! Make an appointment first and get a free bottle of Mo C,More C natural lemon multi-purpose cleaning liquid---------
Hongwei Industrial | Exclusive polishing partner for advanced semiconductor processes
- Exhibition Information:
- Date: September 10 (Wednesday) – September 12 (Friday), 2025
- Location: Taipei Nangang Exhibition Center Hall 1)
- Booth No. I3104 Book a visit now>>>>>
In the precision race of the semiconductor industry, every detail matters.
HonWay Materials co,ltd is deeply engaged in the field of grinding and polishing consumables and rare earth raw materials. With many years of professional experience, competitive prices, stable rare earth supply chain and excellent customization capabilities,
We can be your solid support to improve process efficiency and optimize product yield. We not only provide high-quality materials, but also strive to create exclusive solutions and technical support for you.
HonWay Exhibition Highlights
Diamond heat sink: Pioneer of next generation high performance heat dissipation
As the power density of semiconductor components continues to increase, traditional heat dissipation solutions can no longer meet the demand. HonWay has introduced diamond heat dissipation substrates, using the excellent thermal conductivity of diamond to provide you with a revolutionary heat dissipation solution. This technology is essential for key components (such as RF modules, laser diodes, high-power LEDs, IGBTs, etc.) in high-power applications such as 5G, AI, and electric vehicles. It can effectively reduce thermal resistance and ensure that components remain stable and efficient under extreme conditions.
Advantages of diamond heat dissipation substrate:
- Extreme thermal conductivity: Far exceeds traditional heat dissipation materials and quickly removes component heat.
- High reliability: Improve the stability and life of components in harsh working environments.
- Miniaturization potential: Helps achieve smaller and more highly integrated power module designs.
- Diversified applications: Suitable for a variety of high-power, high-frequency semiconductor components.
Advanced Materials Polishing Solutions: The Key to Achieving Nanoscale Precision
In response to the stringent requirements of compound semiconductors such as silicon carbide (SiC), gallium nitride (GaN) and new-generation materials such as sapphire, Hongwei provides grinding and polishing consumables and technologies designed specifically for them.
We are fully aware of the challenges these materials face in the manufacturing process. Through precise formulations and technologies, we can help you overcome surface defects, achieve the nano-level surface finish and flatness required for components, and comprehensively improve product performance and yield.
High-purity rare earth and palladium raw materials: ensuring a stable and sustainable supply chain
As a leading supplier of rare earth raw materials, HonWay ensures the supply of key rare elements with high purity, stable quality and compliance with environmental standards.
In today’s volatile global supply chain, our stable supply capabilities are a reliable guarantee for your uninterrupted production and controlled product quality, while helping you comply with increasingly stringent ESG regulations.
Customized grinding recipes and technical support: tailored to your challenges
Your process problems are the solutions provided by HonWay.
We are not only a supplier of consumables, but also your technical partner. HonWay has a team of polishing engineers with rich industry experience who can deeply understand your specific needs and pain points. Whether it is adjusting product formulas, optimizing existing processes, or providing on-site technical support, we can tailor the best polishing solution for you to ensure your process is smooth and efficient.
Do you have these problems? HonWay provides solutions!
HonWay solution: Our diamond heat sink substrate has extreme thermal conductivity and high reliability, which can effectively reduce thermal resistance and ensure that your high-power semiconductor components such as 5G, AI, and electric vehicles can still maintain excellent performance and life under extreme operation.
HonWay Solution: Our customized grinding formula and professional technical support can accurately analyze and solve surface defects caused by consumables, significantly improving product yield.
HonWay solution: Through innovative grinding and polishing consumables and optimized process suggestions, we can help you shorten polishing time, significantly improve production efficiency, and reduce single-wafer costs.
HonWay solution: HonWay provides market-competitive prices while ensuring excellent quality, giving you a better total cost of ownership (TCO).
HonWay solution: Our expertise and unique technology in advanced material polishing can help you easily achieve nanometer-level precision and ensure the high performance of next-generation components.
HonWay solution: Our diamond heat sink substrate has extreme thermal conductivity and high reliability, which can effectively reduce thermal resistance and ensure that your high-power semiconductor components such as 5G, AI, and electric vehicles can still maintain excellent performance and life under extreme operation.
Technology Insights / Industry Views
Rare Earth Export Loosening: A Turning Point for US-China Relations?
POSTECH Develops “Hyperadaptor” High-Entropy Alloy: Exceptional Performance Across Extreme Temperature Swings
From Jewelry to Semiconductors: Diamond as a Key Material for Next-Generation Thermal Management
Scientists Synthesize Super Diamond, 40% Harder Than Natural Diamond, with Great Industrial Potential
How to Eliminate Long Wave Marks in External Cylindrical Grinding? Common Causes and Practical Solutions Explained
Rare Earth Elements: The Unsung Heroes Driving Future Technology
What to Do When Short Wave Marks Appear in External Cylindrical Grinding? A Comprehensive Guide to Common Causes and Practical Solutions
Contact Us and Map
Telephone | Tel: +886-7-2231058 |
Exhibition time | 9/10 10:00am-05:00pm 9/11 10:00am-05:00pm 9/12 10:00am-04:00pm |
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