Cerium Oxide Polishing slurry
- The larger the grain size of the cerium oxide, the greater the abrasive power, more suitable for harder materials, whereas the use of glass argues for the use of finer polishing powders.
- The main point is that the grain size of all ceria has a distribution problem. The average or median particle size (D50) determines the speed of polishing, while the maximum particle size (Dmax) determines the precision of polishing.
- The maximum grain size (Dmax) determines the level of polishing accuracy. To achieve high accuracy, the maximum particle size of the polishing powder must be controlled.
- The particles are well suspended, not easy to scratch the surface of the object, can be polished optical glass, cell phone glass…etc.
Product Features
- The softness and hardness are moderate and will not scratch the surface of the polished object.
- Good suspension properties, not easy to precipitate
Application Areas
- High precision optical glass polishing for precision optical devices, hard disk substrates, LCD monitors, etc.
- Precision polishing of optical lenses, fiber optic connectors, microcrystalline glass substrates, crystal surfaces… etc.
Product Specifications
| Model | Product Status | Particle size(um) | use |
| RGB-1935 | Polishing slurry | D50/0.5 | Optical components, blue glass |
| RGB-1938 | Polishing slurry | D50/0.8 | Optical components, blue glass |
*Minimum order quantity is 1 L
If you have special specifications or need customization, please call or write to us, thank you.
Any questions? Contact HonWay
