Knowledge Column

This article focuses on bonding agents, essential materials in grinding tool manufacturing that directly impact the tool’s performance, application range, and durability. Depending on the processing needs and material characteristics, bonding agents can be categorized into types such as metal bonds, ceramic bonds, resin bonds, and electroplated bonds. Each type offers unique advantages and limitations suited to different grinding applications. Selecting the appropriate bond requires balancing these pros and cons based on specific requirements.

As technology advances, the application of various metals across industries has become increasingly diversified. Metallographic material science analysis (commonly known as metallography) has become crucial. Effective metallographic research can significantly enhance product quality and reduce process costs. In this article, we’ll guide you through the complete metallographic research process and share some key points. Among them, grinding and polishing are vital steps in achieving good metallographic results!

In the field of polishing, different metals require specific processing steps and tool selections. This chapter focuses on stainless steel, where the primary goals are to enhance its appearance, smooth the surface, and improve corrosion resistance. Through mirror polishing, imperfections and irregularities on stainless steel surfaces can be removed, resulting in a smooth and glossy finish. This not only improves aesthetics but also enhances the material’s cleanliness and resistance to contamination.
Proper polishing techniques can prevent surface scratches and damage while protecting the stainless steel’s oxide layer, which is crucial for maintaining its corrosion resistance. However, improper handling may cause surface damage, leading to localized corrosion or poor appearance.
The latter part of this chapter includes an experiment on mechanical polishing of stainless steel, providing insights into tool selection, the polishing process, and potential challenges. Readers will gain a deeper understanding of stainless steel’s properties and be able to choose appropriate polishing methods and tools to enhance polishing quality and efficiency.

This chapter introduces zinc metal, highlighting its properties such as malleability, wear resistance, and corrosion resistance. Common issues in polishing, such as scratches and pitting, can affect the difficulty and cost of processing. In the latter part of the chapter, mechanical polishing experiments on zinc are discussed, covering tool selection, processing methods, and problems encountered. This provides readers with a deeper understanding of zinc’s characteristics and how to choose the right polishing tools and techniques to improve polishing quality and efficiency.

對於不同金屬都有對應拋光因素與需求，本章針對鎳這一個金屬展開一連串的介紹如:耐腐蝕性、延展性等及針對鎳的應用，提供了鎳常見的瑕疵如劃痕、細紋、與鑽石的化學反應都影響到後面拋光加工的難易度與時間成本， 文章後段提供了鎳機械拋光的實驗參考，從使用工具、拋光流程、過程中容易出現的問題，讀者能更了解鎳的特性，選擇適合的加工流程、拋光工具，以提升拋光的品質，減少生產成本與時間。

Each metal has specific polishing factors and requirements, and this chapter focuses on copper. It discusses common defects in copper, such as scratches, oxidation, and the orange peel effect, as well as copper’s relatively low hardness, which affects the complexity and cost of subsequent processing. The latter part provides experimental references on mechanical polishing for copper, covering tool selection, polishing workflows, and the problems often encountered during the process. Readers will gain a deeper understanding of copper’s characteristics, helping them choose appropriate processing techniques and polishing tools to improve polishing quality while reducing production costs and time.

Common issues with electroplated grinding wheels include normal wear, grain shedding, clogging, and abrasive dulling. Understanding these problems and their solutions is essential. This article also addresses frequently asked customer questions, such as the pros and cons of electroplated wheels, how to customize them, and how to choose between traditional and superhard wheels, offering useful insights.

Stress issues in wafer grinding and polishing are critical to semiconductor manufacturing quality. Stresses originate from mechanical grinding, chemical mechanical polishing (CMP), and the properties of the wafer material, which can affect the surface flatness, roughness, and electrical properties of the wafer. To manage these stresses, improvements can be made by optimizing machining parameters, employing multi-step processes, local heating, and selecting the right supplier. Establishing standard operating procedures, regular training, and continuous improvement are all key strategies to improve production efficiency and product quality.