HonWay Materials co., Ltd.

In the semiconductor industry, the pursuit of “high precision” never stops. From early micron-level processes to current 3nm and 2nm advanced nodes, chip designs are becoming increasingly complex and structures are shrinking. Consequently, the demands on every aspect of the process are also rising, especially wafer surface flatness and defect control, which are critical for determining finished product yield and reliability.
Traditionally, grinding and polishing consumables were often considered auxiliary tools, assisting in Chemical Mechanical Planarization (CMP) and other related process steps. However, in today’s era, where “atomic-level precision” is the goal, these consumables are no longer mere auxiliary roles. They are now core drivers that enhance process quality and support the advancement of technology nodes. The innovation and performance of consumables profoundly impact the success or failure of every square inch in the wafer fabrication process.