Diamond Compound

Diamond compound is a commonly used polishing agent and gives the best results when used properly.

Tools for polishing, from different types of fibers to sticky pads, are available in different hardnesses. Such as nylon, paper, velvet, cotton and so on.

Careful when polishing:

a． Polishing should be carried out in a dust-free, well-ventilated area, as hard dust particles can easily adhere to the diamond compound and damage the polished surface;

b． Each polishing tool should be matched with only one type of diamond compound and protected from dust;

c． Wash your hands and the workpiece each time you change the diamond compound;

d． Adjust the polishing pressure to the hardness of the polishing tool and the grain size of the diamond compound. For the finest diamond compound, a pressure as large as the weight of the polishing tool is sufficient;

e． Polishing should start from the corners, edges, pieces or other parts of the mold.

4.0 Solving problems in polishing:

The main problem with polishing is over-polishing. Over-polishing means that the longer the polishing time, the worse the surface condition. An over-polished surface is usually characterized by two phenomena: “orange peel” and “pinholes”. It should be noted that it is usually more likely to occur when machine polishing is used.

4.1 Orange peeling:

After polishing, the surface of the workpiece shows irregular peeling like orange peel, which is mainly due to the soft material and excessive polishing pressure, hard material can withstand higher polishing pressure, and it is not easy to be over-polished.

Increasing the polishing pressure to continue polishing when deterioration of the polished surface occurs will inevitably increase the amount of sanding on the surface.

To recondition the surface of the material after deterioration, the following methods can be used:

Method 1:

Fine sanding is used to remove a layer of surface deterioration before polishing, and polishing is started after the final sanding is completed. A lower polishing pressure than the previous one should be used during polishing.

Method 2:

Release the stress at 25°C (45°F) below the last tempering temperature and repeat the polishing process until the surface condition is satisfactory. Start polishing again, but at a lower pressure than before.