HW-Largo (Hexagonal) – Metallographic fine grinding disc Product features
☑️ Streamlined process / Supports both back-end grinding and front-end polishing, improving work efficiency. ☑️ Highly efficient / Flexible carrier combined with high-quality abrasives reduces residual surface scratches, enhancing the quality of subsequent polishing. ☑️ Widely applicable / Suitable for various material hardnesses, providing different abrasive options and grit sizes for soft precision grinding discs.☑️ High flatness / Uniform grinding of both soft and hard materials prevents rounding and chamfering, ensuring sample consistency.☑️ High quality and efficiency / Grid design reduces debris buildup, providing consistent high material removal rates and ensuring cross-section flatness.
Application areas:
- materials science, metal identification, failure analysis, manufacturing, materials research and development, diamond and gemstone processing, electronics and semiconductor industries.
- Copper-clad laminates, double-sided grinders, and single-disc grinders.
Product Specification
Abrasive | Particle size(um) | Size(mm) | Size(in) |
| Diamond | 0.5 1.0 2.0 3.0 6.0 9.0 | Ø127 Ø200 Ø220 Ø230 Ø250 Ø300 Ø350 Ø380 | Ø5 Ø8 Ø8.6 Ø9 Ø9.5 Ø12 Ø14 Ø15 |
| Aluminum Oxide | |||
| Silicon carbide | |||
| Cerium oxide | 0.5 1.0 2.0 3.0 |
1. Product differences
| Metallographic fine grinding disc | Metallographic grinding disc | |
| Abrasive layer | soft | hard |
| Shore hardness | 80 degrees | 90 degrees |
| Introduction | Soft as cowhide | Hard as steel |
| Application | Replaces the three processes of back-end grinding and front-end polishing | Replaces sandpaper for grinding super-hard materials |
2. How to Choose
How to choose abrasives: The specific application depends on the hardness of the workpiece material and your current actual process. like:
- Diamond: super cemented carbide, electronic materials, ceramics.
- Aluminum oxide: soft metal, plastic, glass, IC substrate, packaging materials, semiconductors and various electronic parts, printed circuit boards (PCB) and connectors.
- Silicon Carbide (SiC): Suitable for semiconductor materials (such as silicon wafers and gallium arsenide), electronic materials, superhard metals, ceramics, glass, and gemstones.
- Cerium Oxide (CeO₂): Used for optical glass (lenses, prisms, and other optical components), gemstones, ceramics, semiconductors (such as wafers), and cubic zirconia.
(Note: The above applications are for reference only. The specific use should depend on the hardness of the workpiece material and your current process requirements.)
Grit Selection: A 3.0 μm (4000#) precision grinding disc can be used to transition from coarse grinding with 6.0 μm (2400#) to fine polishing with 1.0 μm. For final polishing, follow with a 0.5 μm polishing solution to achieve precision polishing results. Usage Method: Place the precision grinding disc directly onto the magnetic machine plate without needing a polishing cloth or additional abrasives (polishing solution). You can start the precision grinding process using only tap water.
3. Precautions
- To achieve optimal flatness, avoid placing labels or any items on the back of the disc that could affect the workpiece’s flatness.
- Ensure that the contact surface between the grinding disc and the machine is very flat, clean, and dry to avoid impacting the workpiece’s flatness.
- After use, carefully remove the disc, rinse it with water, and allow it to air dry.
- Avoid bending or damaging the precision grinding disc.
- When installing or removing, handle with care to avoid injury from magnetic attraction.
4. Other options
