HCD.LXZ Spiral PCD cutters Size can be customize

Adjustable spiral angle distribution of diamonds based on processing materials, facilitating chip removal enhanced cutting efficiency. High hardness, fast chip removal, and good thermal conductivity, suitable for high-speed cutting.

  • Spiral diamond tools have characteristics such as high hardness, high compressive strength, fast chip evacuation, good thermal conductivity, and excellent wear resistance.
  • Suitable for high-speed cutting of materials like composites and ceramics, ideal for high-precision machining.
  • High thermal conductivity and efficient chip evacuation performance.
▲ This product is a custom product.
If you need a customized size, please contact customer service
▲Preferential discounts can be enjoyed for large orders, please contact customer service.
Taiwan orders are shipped within approximately 7-14 days.
Overseas orders are shipped within approximately 7-14 days. The actual delivery time depends on the courier company’s delivery situation.

 

 

HCD.LXZ Spiral PCD cutters Product Features

Adjustable spiral angle distribution of diamonds based on processing materials, facilitating chip removal enhanced cutting efficiency. High hardness, fast chip removal, and good thermal conductivity, suitable for high-speed cutting.

  • Spiral diamond tools have characteristics such as high hardness, high compressive strength, fast chip evacuation, good thermal conductivity, and excellent wear resistance.
  • Suitable for high-speed cutting of materials like composites and ceramics, ideal for high-precision machining.
  • High thermal conductivity and efficient chip evacuation performance.
  • Customizable spiral structures to enhance machining efficiency.
  • The lifespan of PCD drills is 10 times longer than that of alloy tools.
  • Different diamond grainularity can meet the requirements for processing various materials.

Application areas:

  • Suitable for various precision high-speed milling operations, CoWoS processes, precision machining, and mold manufacturing.
  • Suitable for cutting various semiconductor substrates, including silicon carbide substrates, glass substrates, ceramic substrates, and alumina substrates.

Product features

HCD.LXZ

ModelProduct TypesApplicationGranularity1. DiameterHelix Angle2. Blade Length3. Matrix
HCD.LXZSpiralHigh-speed millingThin

Medium

Thick

∅6.5~∅12.530°6~20N/A

※ Unit of size(MM)

Material characteristics

PCD cutters characteristics
PCD cutters

Please note

1. Inclination Angle: Single-point PCD tools should not be aligned perpendicular to the grinding wheel center; they typically need to be inclined 10-15°.

2. Careful Placement: When placing the PCD tool into the collet, be sure to avoid collisions between the tool and the grinding wheel surface to prevent damage to the tool or the grinding wheel.

3. Avoid Overheating Damage: Do not quench hot dressing tools. When performing dry dressing, allow sufficient time for the PCD tool to cool down fully to avoid damage caused by overheating.

4. Select Appropriate Tools: When ordering PCD tools, consider the tool’s applicable range. Especially when machining ferrous metals, the chemical reaction between diamond and carbon in steel may accelerate tool wear.

5. Maintenance and Cleaning: When replacing tools, remove all broken tool fragments first to prevent secondary damage to the tools. Ensure that the processing equipment is stable, as unstable equipment is prone to vibrations, which can cause the tools to break.

6. Storage: When storing PDC tools, place them separately and do not place the tips facing each other to avoid damage to the tools.

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