Grinding Wheels for Wafer Surface Grinding

Honway Materials provide customized services,

Manufacturing the most suitable grinding wheels for your wafer surface grinding needs.

Product Features:

• Suitable for various wafer materials, meeting different process requirements.
• Features a stable high material removal rate, effectively shortening processing time and improving production efficiency.
• Excellent wear control design extends the service life of the grinding wheel.
• Low grinding resistance during the grinding process helps protect equipment and workpieces, stabilizing machining quality.

Uses:

• Planarization of silicon wafers
• Backside thinning grinding

Application areas:

• Silicon semiconductor wafers, compound semiconductor wafers, ceramic wafers (aluminum oxide, AlN).
• Wide bandgap semiconductor wafers (SiC, GaN), SAW (Surface Acoustic Wave) filter wafers (LT, LN), sapphire glass wafers.
• TSV (Through-Silicon Via) packaging wafers (copper/compound).

Please specify the following when ordering grinding wheels.

• The shape of the grinding wheel and the dimensions of each part: such as1A1、14A1
• Abrasive type: Diamond
• Grit: e.g:#150
• Concentration: e.g:C-75
• Bond type: For example, resin bond or ceramic bond
• Cooling method: dry grinding or wet grinding
• Quantity and delivery time:
• RPM and processing conditions:
• Processing equipment model:
• Most manufacturers label their grinding wheels with the following information:

Abrasive Type	150 Grit	N Bonding degree	75 Concentration	R Bond	3.0 Abrasive layer thickness
D: Natural Diamonds SD: Artifitial Diamonds	#60 #80 #100 #150 #200 #270 #325 #400 #600	J / Soft L N P R / Hard	25 50 75 100 125 150	R: Resin Bond V: Vitrified	1.0mm 1.5mm 2.0mm 3.0mm 5.0mm 10.0mm

Sample pictures

Specifications Comparison

WH-BH7

This grinding wheel has good self-sharpening effect, so even etched surfaces that are difficult to grind without dressing can be ground continuously without dressing. Due to the use of high-performance bond types and grinding wheel design, the grinding resistance is small, the service life is long, and a high grinding ratio can be obtained.

WH-BH14

This grinding wheel employs a filler that reduces grinding resistance and a multi-porous structure, allowing grinding operations to be completed under extremely low loads. When grinding wafers, it minimizes damage and achieves excellent surface finish quality.

WH-VDW

This grinding wheel successfully ensures the uniform distribution of fine diamond abrasive grains, eliminating the scratching issues commonly associated with ceramic bonds. Due to the strong abrasive retention of the ceramic bond, high-precision mirror-like surface finish grinding can be achieved.

Additionally, this grinding wheel is a multi-porous wheel, which can suppress the increase in grinding resistance.

Any questions? Contact HonWay