Chamfering and Grinding Wheels for Silicon Wafers

Honway Materials provide customized services,

Manufacturing the most suitable chamfering and grinding wheels for your silicon and sapphire wafers.

High-performance grinding wheels specifically designed for chamfering and grinding semiconductor material substrates, featuring a uniform and fine abrasive grain layer structure and manufactured using high-precision finishing technology.

After dressing, they exhibit a low defect rate, excellent quality, and superior machining accuracy.

The product line covers standard grinding wheels suitable for outer periphery and groove processing, and offers three grinding wheel styles: single-groove type, multi-groove type, and rough/fine mixed type, to meet various processing needs.

Product Features:

• Possess excellent shape retention, meeting the strict requirements for high precision and stability in silicon wafer chamfering.
• Adopt a metal bond design, effectively enhancing wear resistance and significantly extending service life, reducing replacement frequency.
• Maintain stable grinding performance even under long-term operation, ensuring consistent and stable machining quality.
• Single or multi-groove designs can be provided according to customer needs, and rough and fine grinding functions can be integrated into one wheel to meet different process conditions.
• Combining the advantages of long lifespan, low dressing frequency, and stable machining capability, helping to reduce overall processing costs.

Uses:

• Mostly metal bond grinding wheels and electroplated bond grinding wheels.
• Chamfering and grinding of silicon wafers and compound semiconductors.
• Compatible with the latest equipment from several representative wafer chamfering machine manufacturers, ensuring high compatibility and stable machining performance.

Application areas:

• Grinding wheels for chamfering and grinding semiconductor material substrates.
• Suitable for various types of processing such as V-shaped, R-shaped, single-groove, or continuous groove.

Please specify the following when ordering grinding wheels.

• The shape of the grinding wheel and the dimensions of each part: such as1A1、14A1
• Abrasive type: Diamond
• Grit: e.g:#150
• Concentration: e.g:C-75
• Bond type: For example, electroplated bond or metal bond
• Grinding wheel style: Single-groove type, multi-groove type, and rough/fine mixed type
• Use: For silicon wafers, sapphire wafers
• Quantity and delivery time:
• RPM and processing conditions:
• Processing equipment model:
• Most manufacturers label their grinding wheels with the following information:

Abrasive Type	150 Grit	N Bonding degree	75 Concentration	R Bond	3.0 Abrasive layer thickness
D: Natural Diamonds SD: Artifitial Diamonds	#60 #80 #100 #150 #200 #270 #325 #400 #600	J / Soft L N P R / Hard	25 50 75 100 125 150	M: Metal bond P: Electroplated	1.0mm 1.5mm 2.0mm 3.0mm 5.0mm 10.0mm

Sample pictures

Any questions? Contact HonWay