As artificial intelligence (AI) and high-performance computing (HPC) applications continue to advance, the semiconductor industry is undergoing a profound technological transformation. Glass, once considered a consumer consumable, is now gradually emerging as a core material for advanced packaging technology. A new market report from the international research firm IDTechEx, titled “Glass in Semiconductors 2026-2036,” delves into the potential of glass in chip packaging, signal transmission, and photonic guidance, revealing its broad prospects in the future of semiconductors.
Table of Contents
Table of Contents
AI and HPC Drive Glass’s Role Transformation
The ever-increasing demand for bandwidth and power density in AI and HPC systems is the main driver behind the rise of glass materials. AI accelerators require thousands of high-speed I/O bumps and a low-noise power delivery network that can handle hundreds of amps of current. While traditional organic substrates offer a cost advantage, they are gradually reaching their limits in terms of flatness and via density. Silicon interposers can provide finer routing but are restricted by high cost and size limitations.
Glass perfectly fills the gap between these two. It possesses a low coefficient of thermal expansion (CTE) and an extremely low dissipation factor, giving it an advantage in high-speed signal transmission. At the same time, large-panel manufacturing technologies from the LCD industry bring the potential for larger glass substrates and reduced costs, accelerating their transition from experimental to commercial use.
High-Frequency Communication and Photonics Integration: Dual Market Engines
The application of glass is not limited to computing packaging. Its low dielectric loss and optical transparency also give it potential in the fields of high-frequency communication and photonics integration. Above the Ka-band, the insertion loss of glass microstrip lines is only half that of organic circuits, making it an ideal choice for 5G/6G communication.
On the other hand, silicon photonics integration and Co-packaged Optics (CPO) also bring new opportunities for glass materials. Engineered glass can simultaneously carry electrical redistribution layers and low-loss optical waveguides, simplifying the process and lowering costs. Combined with Through-Glass Via (TGV) technology, a single glass core can support the integration of both electrical and photonic signals, further expanding its application scope.
Global R&D Actively Invests in Glass Substrates
Currently, many major semiconductor and material manufacturers are already investing in the research and development of glass substrate technology, with validation being conducted in pilot production lines and exploratory factories. At the same time, the processing of large-sized glass panels and the development of low CTE materials are also continuously advancing. PCB manufacturers and equipment suppliers in Taiwan are also benefiting from this new trend, actively developing advanced process equipment that supports large-sized substrates, and promoting the gradual maturation of the ecosystem.
Supply Chain Ecosystem Becomes Key
For glass to truly move towards large-scale mass production, it depends not only on raw materials but also on the establishment of a complete ecosystem. The maturity of laser drilling, copper filling, panel processing, and design automation tools will directly affect yield and cost competitiveness. In addition, glass still faces challenges from silicon and improved organic materials, such as the hybrid redistribution technology being promoted by wafer foundries and the continuous evolution of new-generation ABF core boards.
Market Trends and Future Outlook
Looking ahead, the glass substrate market is expected to enter a period of rapid growth. With the expansion of applications in AI, HPC, 5G/6G communication, and photonics integration, the demand for high-performance, low-loss packaging materials will continue to increase. In the short term, glass will be introduced first in high-end HPC and network switches. In the medium term, it is expected to expand to a wider range of high-frequency communication and optical modules. In the long term, glass may even become one of the standard materials for a new generation of heterogeneous integration and advanced packaging.
Although technical maturity and supply chain construction still pose challenges, the industry has shown a high degree of consensus: glass will play a pivotal role in the next semiconductor decade.
Conclusion
Overall, glass material is gradually moving beyond its traditional role to become a new, potential star in AI and HPC packaging. With its low dielectric loss, thermal stability, and large-panel processing advantages, glass can not only support high-speed, high-power chip designs but also drive the development of high-frequency communication and photonics integration. While challenges remain, as the supply chain improves and technology matures, glass is poised to become a key foundation for new-generation semiconductor packaging.
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