Metal Polishing Materials-Introduction to Nickel
對於不同金屬都有對應拋光因素與需求，本章針對鎳這一個金屬展開一連串的介紹如:耐腐蝕性、延展性等及針對鎳的應用，提供了鎳常見的瑕疵如劃痕、細紋、與鑽石的化學反應都影響到後面拋光加工的難易度與時間成本， 文章後段提供了鎳機械拋光的實驗參考，從使用工具、拋光流程、過程中容易出現的問題，讀者能更了解鎳的特性，選擇適合的加工流程、拋光工具，以提升拋光的品質，減少生產成本與時間。
Science Classroom
Science Classroom : Do you have machining problems? Do your workpieces always have pitting and orange peel? Do you want to know the application of nanotechnology? Here we have a series of industrial science tips to share with you! If you have any questions, please contact us directly and we will help you to solve your problems.
Metal Polishing Materials-Introduction to Copper
Each metal has specific polishing factors and requirements, and this chapter focuses on copper. It discusses common defects in copper, such as scratches, oxidation, and the orange peel effect, as well as copper’s relatively low hardness, which affects the complexity and cost of subsequent processing. The latter part provides experimental references on mechanical polishing for copper, covering tool selection, polishing workflows, and the problems often encountered during the process. Readers will gain a deeper understanding of copper’s characteristics, helping them choose appropriate processing techniques and polishing tools to improve polishing quality while reducing production costs and time.
What is the current status of the grinding wheel? – Electroplated Grinding Wheel Section
Common issues with electroplated grinding wheels include normal wear, grain shedding, clogging, and abrasive dulling. Understanding these problems and their solutions is essential. This article also addresses frequently asked customer questions, such as the pros and cons of electroplated wheels, how to customize them, and how to choose between traditional and superhard wheels, offering useful insights.
Guide to Repairing Metal Polishing Defects: Solutions to Common Problems and Recommendations for Quality Materials and Tools
Guide to Repairing Metal Polishing Defects: Solutions to Common Problems and Quality Materials and Tools Defects such as scratches, uneven roughness, oxidized spots, and lack of finish are commonly found in metal polishing and plastic polishing, which directly affects the quality of the products and the life of the molds. The article focuses on these problems and provides specific repair programs, such as the correct choice of polishing tools, control pressure and time, and timely cleaning of the surface. In addition, suitable polishing materials should be selected according to the characteristics of the mold to improve the polishing effect. Through continuous optimization of process and equipment updating, we can effectively reduce the production cost and improve the production efficiency to ensure the quality of the molds.
Translated with DeepL.com (free version)
Optimizing Stress Control During Wafer Grinding and Polishing: A Practical Guide to Improving Semiconductor Manufacturing Quality
Stress issues in wafer grinding and polishing are critical to semiconductor manufacturing quality. Stresses originate from mechanical grinding, chemical mechanical polishing (CMP), and the properties of the wafer material, which can affect the surface flatness, roughness, and electrical properties of the wafer. To manage these stresses, improvements can be made by optimizing machining parameters, employing multi-step processes, local heating, and selecting the right supplier. Establishing standard operating procedures, regular training, and continuous improvement are all key strategies to improve production efficiency and product quality.
Grinding – Abrasives Introduction
Essential Characteristics of Abrasives are: high hardness, toughness, chemical composition, thermal stability (strength), thermal stability (chemical stability), grain processing capability, mechanical strength, high grit size.
1. High Hardness: The hardness of the abrasive must be higher than the hardness of the workpiece.
2. Toughness: The ability to resist breaking under pressure or impact. Adequate toughness ensures that the micro-edges of the abrasive particles can perform cutting actions, and when dulled, they can create new cutting micro-edges.
3. Chemical Composition: The chemical composition of the abrasive reflects its quality and performance. The higher the purity, the better the properties. Aluminum oxide abrasives, for example, are categorized based on the content of aluminum oxide and impurities.
4. Thermal Stability (Strength): The abrasive must maintain its necessary physical and mechanical properties even at high temperatures, as the grinding zone temperature usually ranges from 400 to 1000°C.
5. Thermal Stability (Chemical Stability): The abrasive should be chemically stable, resistant to adhesion or diffusion reactions that could cause clogging or dulling of the tool.
6. Grain Processing Capability: The abrasive grains should be uniform, with a regular shape.
7. Mechanical Strength: Due to the repeated grinding forces, impact loads, and high grinding temperatures, the abrasive must have sufficient mechanical strength to withstand these effects.
8. High Grit Size: Abrasives should have a high grit size for effective material removal.
Comparison Chart of Grinding Polishing and Surface Roughness
In product manufacturing, surface quality is a critical factor. Surface roughness refers to the tiny irregularities on a surface that affect functionality and durability, while smoothness describes the degree of surface flatness and light reflection. Roughness impacts gloss; the rougher the surface, the lower the gloss. To improve gloss, polishing materials are often used to remove minor irregularities, achieving a smoother surface. Understanding these concepts and effectively controlling roughness and gloss is key to ensuring high product quality, enhancing both performance and appearance.
Differences Between RA and SA
RA (Roughness Average) and SA (Surface Area) are two measurement indicators of surface roughness. RA is the most commonly used two-dimensional roughness parameter, evaluating surface smoothness by calculating the arithmetic mean of the absolute deviations of all points on the surface profile line from the reference line over the measured length. It is typically used for roughness detection on flat surfaces. On the other hand, SA is a three-dimensional surface roughness indicator that takes into account the height variations and other features of the surface profile. It is often used for more complex surface analyses, such as high-precision manufacturing or optical surface treatments. SA provides a more comprehensive view of surface roughness, making it suitable for applications that require detailed three-dimensional data.
Terminology and definition of surface roughness
Surface roughness is a standard established by industrial norms, but upon closer inspection, the same Ra value can correspond to different waveforms. To improve yield, we need to explore other methods that can enhance our measurement accuracy.
What is surface roughness?
“Surface roughness” plays a crucial role in engineering and manufacturing. Surface roughness describes the smoothness of a surface, which affects various aspects of workpiece characteristics such as airtightness, mating performance, rigidity, and more. Unlike “surface flatness,” surface roughness measures the degree of surface irregularities, making it especially important for parts that require precise fitting or contact. Understanding the need to pursue “appropriate surface roughness” rather than extreme smoothness is essential to meet different application requirements.
