HWES25 Wafer Packaging Dicing Blade – Soft Blade

Honway Materials provide customized services,

Make the most suitable wafer packaging dicing blade for you

 

It is suitable for processing PCB substrate, EMC substrate, Chip LED substrate and various hard and brittle materials such as LTCC, PZT, TGG, etc.

Offering a choice of resin and metal base materials to meet various processing needs.

 

Product Features:

• Ultra-Thin, High-Rigidity Design: The blade features an extremely small thickness and excellent rigidity, effectively reducing the kerf width while maintaining high cutting precision, which increases material utilization.

• Three Bond Systems to Choose From: You can select from resin, metal, and electroplated bond systems to provide the most suitable cutting performance and blade life for different material properties and processing requirements.

• Electroplated Bond for High Straightness and High-Speed Processing: Adopts a new generation of high-strength electroplated bond, which not only improves cutting precision and straightness but also supports high-speed feeding conditions, increasing productivity.

• Adjustable Concentration for Quality and Lifespan: Offers various diamond concentration levels that can be precisely selected based on the application. This allows for flexible matching to meet low backside chipping and long-lifespan requirements, improving processing stability.

• High Customization for Difficult-to-Cut Materials: Blade specifications can be adjusted according to customer needs, and special processing technologies are supported to handle composite materials that are both sticky and brittle, such as ceramic substrates with silicone.

• Excellent Thickness Uniformity: Special consolidation, sintering, and electroplating processes ensure the entire blade maintains excellent thickness uniformity, guaranteeing long-term stable cutting quality.

• Capable of High-Speed Cutting: Soft blade type designs can achieve cutting speeds of up to 200 mm/s and have a lifespan of over 7000 m, making them particularly suitable for high-efficiency processing in mass production environments.

Uses:

• Resin Base: Suitable for processing hard materials.
• Metal Base: Provides a longer service life.
• Used during the semiconductor packaging cutting process stage.
• For processing difficult-to-cut materials, such as ceramic substrates with silicone.

Application areas:

• Suitable for cutting ceramics, brittle materials, optical glass, printed circuit boards, and electronic components, especially for semiconductor packaging.
• Applicable to hard and brittle materials such as PCB substrates, EMC substrates, Chip LED substrates, and LTCC, PZT, TGG.

Please specify the following when ordering dicing blades:

• Shape and dimensions of the dicing blade:
• Outer Diameter (mm): for example, 65
• Thickness (mm): for example, 0.08
• Thickness Tolerance (mm): for example, B ±0.010
• Grit Size: for example, #800
• Bond type: For example, N general-purpose
• Concentration: for example, 130
• Number of Grooves (pcs): for example, S16
• Use: for PCB substrates, EMC substrates
• Quantity and delivery time:
• RPM and processing conditions:
• Processing equipment model:
• Most manufacturers mark the following information on the dicing blades, with a specification example: 56×0.08B×40 800H130S16

Outer Diameter (mm)	Thickness (mm)	Thickness Tolerance (mm)	Inner Diameter (mm)	Grit Size	Bond type	Concentration (Volume concentration)	Numbers of Grooves (pcs)
50 52 54 56 58 59	0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.24 0.26 0.28	P ±0.003 A ±0.005 B ±0.010 C ±0.015	10	#340 #400 #500 #600 #800 #1000 #12 00	S Sharp Type N General Type H High Strength Type	30 50 70 90 110 130 150	S16 S32 S48

Sample images:

 

Product technical advantages:

Carefully selected high-compactness diamond crystal shapes and uniform particle size distribution ensure the cleanliness of the machined surface and cutting stability, improving finished product yield.

By precisely controlling diamond concentration grades, the HWE25 series effectively balances processing stability and tool life. It shows outstanding performance, especially in reducing wafer backside chipping, to achieve high-yield and high-reliability cutting results.

The blade possesses excellent chemical stability, effectively resisting corrosion risks in wet or CO₂-assisted cutting environments, significantly extending blade life.

The ultra-narrow kerf width, with a minimum of 10 μm, meets the dicing needs of high-density layouts and narrow street wafers like GaAs LEDs, improving wafer utilization and reducing material loss.

Suitable for high-speed operation environments, it can effectively prevent offset phenomena like “snake mark.

Use Case:

PCB substrate are required no metal burrs or roll-over (upturned edges), no smearing or fiber pull-out on the side walls.

Precautions:

• Check the Dicing Blade: Before installation, be sure to carefully inspect the dicing blade for cracks or chips. If damage is found, stop using it immediately to prevent danger.
• Confirm Rotation Direction: Ensure that the rotation direction mark on the dicing blade matches the actual rotation direction of the machine’s spindle. Using it in reverse will affect the cutting effect and blade life.
• Use the Correct Blade: Only use dicing blades that meet the specifications of the machine tool and processing conditions, avoiding processing failure or equipment damage due to non-compliant specifications.
• Immediate Shutdown: During the processing, if abnormal sounds, vibrations, or non-smooth cutting occurs, immediately stop the machine’s operation and find the cause before continuing.
• Regular Dressing: When you find that the cutting efficiency decreases, you should dress the blade. Continuing to use a dull blade may lead to overheating, overload, or even breakage.
• Do Not Touch: When the dicing blade is rotating, it is strictly forbidden to touch it with your hands or other body parts to avoid personal injury.

Any questions? Contact HonWay