Diamond Substrate/Diamond Wafer

Diamond Substrate/Diamond Wafer

Honway Materials provide customized services,

Manufacturing the most suitable diamond substrate/diamond wafer for you.

 

Product Features:

• CVD diamond is manufactured using the Chemical Vapor Deposition method.
• Diamond possesses the highest thermal conductivity among all known materials, enabling effective and rapid heat dissipation.
• Possesses excellent wear resistance and damage resistance. Suitable for various high-durability applications, including precision cutting tools, industrial saw blades, and drilling equipment.
• Exhibits high transparency and low absorption across a broad wavelength range, making it an ideal material for optical windows, lenses, and high-performance optical components.
• Highly resistant to corrosion from acids, alkalis, and most chemical substances, maintaining stable performance for extended periods even in harsh chemical environments.
• Non-toxic and does not cause rejection reactions with human tissues, widely used in medical devices and implantable devices.

Application areas:

• Thermal Interface Materials (TIMs): Diamond wafers can be used as high-efficiency thermal interface materials between chips, modules, and heat sinks, effectively reducing thermal resistance, significantly improving thermal conductivity efficiency, and ensuring stable equipment operation.

• Electronic Packaging and Substrates: In the semiconductor packaging field, diamond wafers provide excellent heat dissipation performance, supporting continuous operation of components in high power density environments, further promoting the miniaturization and high performance of electronic products.

• Server Applications: Can serve as an ideal heat spreader for high-power components such as GaN or SiC crystals, effectively reducing internal temperature rise, extending component lifespan, and improving system reliability. In addition, its excellent mechanical strength and high-temperature resistance are also very suitable for advanced packaging technologies such as 2.5D/3D stacking and high-performance computing platforms in data centers.

• LED and Optoelectronic Components: Applied in fields such as LEDs and optoelectronic components, diamond wafers can significantly improve thermal management, extend component lifespan, and enhance luminous brightness and energy efficiency, meeting the demands of high-end optoelectronic applications.

• Insulation Substrates: CVD diamond wafers are used as insulation substrates for high-performance semiconductors. Their electrical insulation and high thermal conductivity make them ideal for power devices and RF (radio frequency) components.

• Medical Devices: Industrial-grade diamonds are also used in some medical fields, such as high-precision surgical instruments and dental drills. Due to diamond’s high hardness and wear resistance, it can improve the service life and accuracy of medical devices.

Product Specification:

Grade	Optical Grade	Heat sink grade
Diamond Type	Monocrystalline	Polycrystalline
Wafer size	Maximum 15*15mm², customizable	2 inches, customizable
Grit size		≤10μm
Diameter tolerance	﹢0.1, -0mm	﹢0.1, -0mm
Thickness		0.3-1.5mm
Thickness after polishing	0.1~2mm	0.2-1.0mm
Thickness tolerance	±0.02mm≤10mm ±0.03mm, 10~15mm	±50μm
Crystallographic direction	100
Surfaece treatment-	Polishing, Ra<2nm
Growth surface roughness		<100nm Ra
Nucleation surface roughness		<30nm Ra
Standard thickness		300μm

※ If you have any customized needs, please contact Honway

Physical Properties:

Grade	Optical Grade	Heat sink grade
Diamond Type	Monocrystalline	Polycrystalline
Density	3.52 g/cm3	3.52 g/cm3
Raman full width at half maximum (FWHM)	~2.1 cm⁻¹
Nitrogen concentration	<0.5 ppm
Thermal conductivity	1900~2200 W/(m·K) 300K	1200~2000 W/(m·K) 300K
Transmittance	>70% 1064 nm
Refractive Index	2.379 @ 10.6 um
Young’s modulus		850GPa
Chemical stability		Insoluble in all acids and bases
Breaking strength		350GPa
Parallelism		<4μm/cm

 

Diamond Specifications Comparison:

	Monocrystalline CVD Diamond Wafer	Polycrystalline CVD Diamond Wafer
Structure	Single, continuous crystal structure	Multiple randomly oriented small crystals
Mechanical properties	Excellent hardness, strength and wear resistance	Low strength, affected by grain boundaries
Thermal conductivity	Higher, excellent heat dissipation performance	Lower (due to grain boundaries)
Optical properties	Exceptional optical clarity and precision	Low clarity, may have flaws
Electrical properties	Highly controllable, direction dependent	High isotropy, low controllability
Application	Electronics, optics, high performance applications	Industrial tools, radiators, abrasives, heat dissipation materials

 

Performance comparison of diamond and other common infrared materials:

Physical Properties	Unit	Diamond		ZnSe	ZnS	Ge	Si	GaAs	Al₂O₃
Band gap	eV	5.48		2.7	3.9	0.664	1.11	1.42	9.9
Cut-off wavelength	μm			20	14	23			5.5
Absorption coefficient		0.1~0.3		0.005	0.2	0.02	0.35	0.01
Absorption coefficient	10.6 μm	0.1~0.6		0.0005	0.2	0.02
Microhardness	kg/mm²	8300		137	230	780	1150	721	190
Refractive index		2.38		2.40	2.19	4.00	3.42	3.28	1.63
dn/dT	10⁻³/K	1.0		6.4	4.1	40	13	15	1.3
Thermal conductivity	W/(cm·K)	18~22		0.19	0.27	0.59	1.63	0.55	0.35
Coefficient of thermal expansion	10⁻⁶K⁻¹	Optical Grade	1.3	7.6	7.9	5.9	2.56	5.9	5.8
		Heat sink grade	0.8~1.0

 

Any questions? Contact HonWay