Diamond grinding fluid is made of abrasive particles dispersed in media, it is a kind of lapping product with excellent chemical and mechanical properties.

Widely used for grinding and precision polishing of silicon wafers, compound crystals, optical devices, liquid crystal panels, gemstones, metal workpieces and so on.  

Polishing & Grinding Fluid Series

◎Monocrystalline Diamond Solution (MDS)
◎Polycrystalline Diamond Solution (PDS)
◎Nano Diamond Solution (NDS)

Monocrystalline Diamond Solution:Good cutting effect, suitable for grinding and polishing of hard materials.

Polycrystalline Diamond Solution:With unique toughness and self-sharpening, it can achieve high grinding force and is not easy to scratch. Suitable for grinding and polishing of precision metal materials.

Nano Diamond Solution:Good dispersion stability, suitable for ultra-precision polishing.

Monocrystalline Diamond Powder

Diamond micropowder is a kind of super-hard grinding and polishing material produced by selecting high-quality monocrystalline synthetic diamond as raw material and going through the processes of crushing, shaping, purifying, grading, and post-processing, etc. It has high hardness, strength, toughness, thermal conductivity, good thermal stability, and impact resistance, etc. The diamond micropowder is a kind of super-hard grinding and polishing material.

Monocrystalline Diamond Powder Specification
General Specification Unit: micron
0-0.5 (0.25um) 0-1
(0.5um)
0-2
(1um)
1-3
(2um)
2-4
(3um)
4-6
(5um)
6-12 (8um) 8-16 (10um) 10-20 (15um) 15-25 (20um) 20-30 (25um) 20-40 (30um)
35-45 (40um) 55-65 (50um) 50-60 (55um)

㊟ All of the above are general rules, which can be adjusted according to customer’s needs and accept customization.

Polycrystalline Diamond Powder

It is a new type of grinding material made from high quality diamond through a unique process.

Polycrystalline Diamond Powder Specifications
General Specification Unit: micron
0-2 (1um) 1-3 (2um) 2-4 (3um)
3-5 (4um) 4-6 (5um) 4-8 (6um)
6-8 (7um) 7-9 (8um) 8-10 (9um)
9-11 (10um) 10-12 (11um)

㊟ All of the above are general rules, which can be adjusted according to customer’s needs and accept customization.

It is a new type of grinding material made from high quality diamond through a unique process.

Polycrystalline Diamond Powder Specifications
General Specification Unit: micron
0-2 (1um) 1-3 (2um) 2-4 (3um)
3-5 (4um) 4-6 (5um) 4-8 (6um)
6-8 (7um) 7-9 (8um) 8-10 (9um)
9-11 (10um) 10-12 (11um)

㊟ All of the above are general rules, which can be adjusted according to customer’s needs and accept customization.

Nano Diamond

Nano diamond is the use of negative oxygen balanced explosives in the detonation process of free carbon, control the pressure and temperature of the detonation so that it is converted into 5-20 nm particle diameter
Microcrystalline diamond particles, special synthesis conditions make its basic particles nearly spherical, with rich functional groups on the surface, and the specific surface area is increased by an order of magnitude compared with ordinary diamond products; nanodiamonds not only have better hardness and grinding characteristics than ordinary man-made diamonds, but also have the new characteristics of nanofunctional materials.

Nano diamond is the use of negative oxygen balanced explosives in the detonation process of free carbon, control the pressure and temperature of the detonation so that it is converted into 5-20 nm particle diameter
Microcrystalline diamond particles, special synthesis conditions make its basic particles nearly spherical, with rich functional groups on the surface, and the specific surface area is increased by an order of magnitude compared with ordinary diamond products; nanodiamonds not only have better hardness and grinding characteristics than ordinary man-made diamonds, but also have the new characteristics of nanofunctional materials.

Nano Diamond Specifications
General Specification
Unit: Nano
50nm 80nm 100nm 120nm
150nm 200nm 300nm 500nm
800nm 1000nm

㊟ All of the above are general rules, which can be adjusted according to customer’s needs and accept customization.

Cerium Oxide Polishing Solution

The particles are well suspended, not easy to scratch the surface of the object, can be used to polish optical glass, cell phone glass, etc….

  • High precision optical glass polishing for precision optical devices, hard disk substrates, LCD monitors…etc.
  • Precision polishing of optical lenses, fiber optic connectors, microcrystalline glass substrates, crystal surfaces, and more.
It can be divided into two colors: 1 high purity cerium oxide (white milky liquid), 2 cerium hydrazine (brownish red liquid).
The two colors can be divided into a variety of series and specifications, customers can choose according to their needs.
※The particle size specification can be adjusted according to the customer’s needs.

The particles are well suspended, not easy to scratch the surface of the object, can be used to polish optical glass, cell phone glass, etc….

  • High precision optical glass polishing for precision optical devices, hard disk substrates, LCD monitors…etc.
  • Precision polishing of optical lenses, fiber optic connectors, microcrystalline glass substrates, crystal surfaces, and more.
It can be divided into two colors: 1 high purity cerium oxide (white milky liquid), 2 cerium hydrazine (brownish red liquid).
The two colors can be divided into a variety of series and specifications, customers can choose according to their needs.
※The particle size specification can be adjusted according to the customer’s needs.
Silicon Dioxide Polishing Solution
Composed of high purity silicon oxide particles, it is not easy to scratch the surface of processed parts.
  • Silicon Wafers, Silicon Carbide Wafers, Sapphire Wafers, Compound Semiconductor Wafers, Gallium Arsenide Wafers, Gallium Nitride Wafers, Precision Optical Components, Various Circuit Substrates…etc.
  • Ceramics, stone…etc. Polishing.
※Each product varies in particle size, solid content, distribution density, etc. Therefore, there are different formulations for each product. Please inform us of the main polishing material so that we can prepare the most suitable polishing solution for our customers.
Composed of high purity silicon oxide particles, it is not easy to scratch the surface of processed parts.
  • Silicon Wafers, Silicon Carbide Wafers, Sapphire Wafers, Compound Semiconductor Wafers, Gallium Arsenide Wafers, Gallium Nitride Wafers, Precision Optical Components, Various Circuit Substrates…etc.
  • Ceramics, stone…etc. Polishing.
※Each product varies in particle size, solid content, distribution density, etc. Therefore, there are different formulations for each product. Please inform us of the main polishing material so that we can prepare the most suitable polishing solution for our customers.

Aluminum oxide polishing solution

Good suspension, high purity, fine particle size, not easily scratched
It is mainly used for polishing optical crystals, electronic glass, liquid crystal glass, and so on.

  • Magnetic head, sapphire, crystal, semiconductor polishing.
  • Precision polishing of metals, ceramics, glass and other hard materials.
※Each product varies in particle size, solid content, distribution density, etc. Therefore, there are different formulations for each product. Please inform us of the main polishing material so that we can prepare the most suitable polishing solution for our customers.
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