{"id":123249,"date":"2025-08-05T13:31:57","date_gmt":"2025-08-05T05:31:57","guid":{"rendered":"https:\/\/honwaygroup.com\/product\/hws25-wafer-packaging-dicing-blade-hard-blade\/"},"modified":"2025-08-05T13:31:57","modified_gmt":"2025-08-05T05:31:57","slug":"hws25-wafer-packaging-dicing-blade-hard-blade","status":"publish","type":"product","link":"https:\/\/honwaygroup.com\/en\/product\/hws25-wafer-packaging-dicing-blade-hard-blade\/","title":{"rendered":"HWS25 Wafer Packaging Dicing Blade &#8211; Hard Blade"},"content":{"rendered":"<h1>HWS25 Wafer Packaging Dicing Blade &#8211; Hard Blade<\/h1>\n<h4><strong><span class=\"red\">Honway Materials provide customized services,<\/span><\/strong><\/h4>\n<h4><strong><span class=\"red\">Make the most suitable wafer electroplated dicing blade for you<\/span><\/strong><\/h4>\n<p>&nbsp;<\/p>\n<p>Suitable for processing semiconductor wafers, packaging substrates, ceramic LED substrates, semiconductor packaging substrates, and various hard and brittle materials like PZT and TGG.<\/p>\n<p>Offering a choice of<strong> resin and metal base<\/strong> materials to meet various processing needs.<\/p>\n<h2>Product Features:<\/h2>\n<ul>\n<li data-start=\"82\" data-end=\"105\"><strong data-start=\"89\" data-end=\"103\">High Wear Resistance and Blade Stability<\/strong>: The tool features excellent wear resistance and structural stability, effectively controlling the side steps of the chip particle and ensuring consistent particle size, which improves cutting yield and process stability.<\/li>\n<li data-start=\"82\" data-end=\"105\">\n<p data-start=\"163\" data-end=\"184\"><strong data-start=\"170\" data-end=\"182\">Strict Diamond Raw Material Control<\/strong>: Uses ultra-narrow particle size distribution of high-purity diamond micro-powder, paired with precision inspection technology, to effectively eliminate large, long-rod, and plate-like irregular particles, significantly reducing the risk of chipping on the front side of the wafer.<\/p>\n<\/li>\n<li data-start=\"82\" data-end=\"105\">\n<p data-start=\"163\" data-end=\"184\"><strong data-start=\"253\" data-end=\"265\">Ultra-High Blade Strength Design<\/strong>: A unique electroplating process achieves extremely high blade strength, which prevents &#8220;snake cutting&#8221; phenomena. When cutting thick wafers, it can also maintain the verticality of the die sides, preventing oblique cuts and ensuring stable processing under high loads.<\/p>\n<\/li>\n<li data-start=\"82\" data-end=\"105\">\n<p data-start=\"355\" data-end=\"380\"><strong data-start=\"362\" data-end=\"378\">Precision Process to Prevent Backside Chipping and Cracking<\/strong>: The cutting process is specifically designed for ultra-thin wafers and small-die wafers, effectively preventing backside chipping and cracking issues, and improving the integrity and quality of the finished product.<\/p>\n<\/li>\n<\/ul>\n<h2>Uses:<\/h2>\n<ul>\n<li>Resin Base: <span style=\"font-weight: 400;\">Suitable for processing hard materials<\/span>.<\/li>\n<li>Metal Base: Provides a longer service life.<\/li>\n<li>Used during the semiconductor packaging cutting process stage.<\/li>\n<li><span style=\"font-weight: 400;\">For processing difficult-to-cut materials, such as ceramic substrates with silicone.<\/span><\/li>\n<\/ul>\n<h2>Application areas:<\/h2>\n<ul>\n<li><span style=\"font-weight: 400;\">Suitable for hard and brittle materials such as ceramic LED substrates, semiconductor packaging substrates, PZT, and TGG.<\/span><\/li>\n<\/ul>\n<h4><strong>Please specify the following when ordering dicing blades:<\/strong><\/h4>\n<ul>\n<li>Shape and dimensions of the dicing blade:<\/li>\n<li><span style=\"font-weight: 400;\">Outer Diameter (mm): for example, 58<\/span><\/li>\n<li><span style=\"font-weight: 400;\">Protrusion Amount (mm): 4.0<\/span><\/li>\n<li><span style=\"font-weight: 400;\">Thickness (mm)<\/span>: for example, 0.20<\/li>\n<li><span style=\"font-weight: 400;\">Thickness Tolerance (mm)<\/span>: for example, <span style=\"font-weight: 400;\">B \u00b10.010<\/span><\/li>\n<li>Grit Size: for example, #400<\/li>\n<li>Bond Type: for example, <span style=\"font-weight: 400;\">S sharp type<\/span><\/li>\n<li>Concentration: for example, 30<\/li>\n<li><span style=\"font-weight: 400;\">Number of Grooves (pcs): for example, S48<\/span><\/li>\n<li>Use: for <span style=\"font-weight: 400;\">ceramic LED substrates<\/span><\/li>\n<li>Quantity and delivery time:<\/li>\n<li>RPM and processing conditions:<\/li>\n<li>Processing equipment model:<\/li>\n<li>Most manufacturers mark the following information on the dicing blades, with a specification example: 58\u00d74.0\u00d70.2B 400S30S48<\/li>\n<\/ul>\n<table>\n<tbody>\n<tr>\n<td><span style=\"font-weight: 400;\">Outer Diameter (mm)<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Exposure (mm)<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Thickness (mm)<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Thickness Tolerance (mm)<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Grit Size<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Bond type<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Concentration (Volume concentration)<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Numbers of Grooves (pcs)<\/span><\/td>\n<\/tr>\n<tr>\n<td><span style=\"font-weight: 400;\">56<\/span><\/p>\n<p><span style=\"font-weight: 400;\">58<\/span><\/td>\n<td><span style=\"font-weight: 400;\">2.0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">2.2<\/span><\/p>\n<p><span style=\"font-weight: 400;\">2.4<\/span><\/p>\n<p><span style=\"font-weight: 400;\">2.6<\/span><\/p>\n<p><span style=\"font-weight: 400;\">2.8<\/span><\/p>\n<p><span style=\"font-weight: 400;\">3.0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">3.2<\/span><\/p>\n<p><span style=\"font-weight: 400;\">3.4<\/span><\/p>\n<p><span style=\"font-weight: 400;\">3.6<\/span><\/p>\n<p><span style=\"font-weight: 400;\">3.8<\/span><\/p>\n<p><span style=\"font-weight: 400;\">4.0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">4.2<\/span><\/p>\n<p><span style=\"font-weight: 400;\">4.4<\/span><\/p>\n<p><span style=\"font-weight: 400;\">4.6<\/span><\/td>\n<td><span style=\"font-weight: 400;\">0.06<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.08<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.10<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.12<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.14<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.16<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.18<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.20<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.22<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.24<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.26<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.28<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.30<\/span><\/p>\n<p><span style=\"font-weight: 400;\">0.32<\/span><\/td>\n<td><span style=\"font-weight: 400;\">A \u00b10.005<\/span><\/p>\n<p><span style=\"font-weight: 400;\">B \u00b10.010<\/span><\/p>\n<p><span style=\"font-weight: 400;\">C \u00b10.015<\/span><\/td>\n<td><span style=\"font-weight: 400;\">#340<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#400<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#500<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#600<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#800<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#1000<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#12<\/span><\/p>\n<p><span style=\"font-weight: 400;\">00<\/span><\/td>\n<td><span style=\"font-weight: 400;\">S Sharp Type<\/span><\/p>\n<p><span style=\"font-weight: 400;\">N General Type<\/span><\/p>\n<p><span style=\"font-weight: 400;\">H High Strength Type<\/span><\/td>\n<td><span style=\"font-weight: 400;\">30<\/span><\/p>\n<p><span style=\"font-weight: 400;\">50<\/span><\/p>\n<p><span style=\"font-weight: 400;\">70<\/span><\/p>\n<p><span style=\"font-weight: 400;\">90<\/span><\/p>\n<p><span style=\"font-weight: 400;\">110<\/span><\/p>\n<p><span style=\"font-weight: 400;\">130<\/span><\/p>\n<p><span style=\"font-weight: 400;\">150<\/span><\/td>\n<td><span style=\"font-weight: 400;\">S16<\/span><\/p>\n<p><span style=\"font-weight: 400;\">S32<\/span><\/p>\n<p><span style=\"font-weight: 400;\">S48<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2>Sample images:<\/h2>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/04\/1A1.jpg\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-full wp-image-93178 aligncenter\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/04\/1A1.jpg\" alt=\"\" width=\"520\" height=\"198\"><\/a><\/p>\n<p>&nbsp;<\/p>\n<h2>Product technical advantages:<\/h2>\n<p>Carefully selected high-compactness diamond crystal shapes and uniform particle size distribution ensure the cleanliness of the machined surface and cutting stability, improving finished product yield.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%871.avif\"><img decoding=\"async\" class=\"alignnone wp-image-121156 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%871.avif\" alt=\"\" width=\"495\" height=\"330\"><\/a><\/p>\n<p>By precisely controlling diamond concentration grades, the HWE25 series effectively balances processing stability and tool life. It shows outstanding performance, especially in reducing wafer backside chipping, to achieve high-yield and high-reliability cutting results.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%873.avif\"><img decoding=\"async\" class=\"alignnone wp-image-121165 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%873.avif\" alt=\"\" width=\"467\" height=\"325\"><\/a><\/p>\n<p>The blade possesses excellent chemical stability, effectively resisting corrosion risks in wet or CO\u2082-assisted cutting environments, significantly extending blade life.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-02.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121355\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-02-1024x709.jpg\" alt=\"\" width=\"467\" height=\"323\"><\/a><\/p>\n<p><strong data-start=\"465\" data-end=\"486\">The ultra-narrow kerf width, with a minimum of 10 \u03bcm<\/strong>, meets the dicing needs of high-density layouts and narrow street wafers like GaAs LEDs, improving wafer utilization and reducing material loss.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%876.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121192 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%876.avif\" alt=\"\" width=\"467\" height=\"338\"><\/a><\/p>\n<p>Suitable for high-speed operation environments, it can effectively prevent offset phenomena like &#8220;snake mark.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%877.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121201 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%877.avif\" alt=\"\" width=\"501\" height=\"332\"><\/a><\/p>\n<h2>Use Case:<\/h2>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%8711.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121443 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%8711.avif\" alt=\"\" width=\"562\" height=\"526\"><\/a><\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%8713.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121452 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%8713.avif\" alt=\"\" width=\"797\" height=\"298\"><\/a><\/p>\n<p>LED bead ceramic packaging substrate: No sealing on the front, back, or sides, no steps on the sides.<\/p>\n<h2>Precautions:<\/h2>\n<ul>\n<li><b>Check the Dicing Blade<\/b>: Before installation, be sure to carefully inspect the dicing blade for cracks or chips. If damage is found, stop using it immediately to prevent danger.<\/li>\n<li><b>Confirm Rotation Direction<\/b>: Ensure that the rotation direction mark on the dicing blade matches the actual rotation direction of the machine&#8217;s spindle. Using it in reverse will affect the cutting effect and blade life.<\/li>\n<li><b>Use the Correct Blade<\/b>: Only use dicing blades that meet the specifications of the machine tool and processing conditions, avoiding processing failure or equipment damage due to non-compliant specifications.<\/li>\n<li><b>Immediate Shutdown<\/b>: During the processing, if abnormal sounds, vibrations, or non-smooth cutting occurs, immediately stop the machine&#8217;s operation and find the cause before continuing.<\/li>\n<li><b>Regular Dressing<\/b>: When you find that the cutting efficiency decreases, you should dress the blade. Continuing to use a dull blade may lead to overheating, overload, or even breakage.<\/li>\n<li><b>Do Not Touch<\/b>: When the dicing blade is rotating, it is strictly forbidden to touch it with your hands or other body parts to avoid personal injury.<\/li>\n<\/ul>\n<p><span style=\"font-size: 16px;\">Any questions? <\/span><a style=\"font-size: 16px; background-color: #ffffff;\" href=\"https:\/\/honwaygroup.com\/en\/contact-honway\/\" target=\"_blank\" rel=\"nofollow noopener\">Contact HonWay<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Suitable for processing semiconductor wafers, packaging substrates, ceramic LED substrates, semiconductor packaging substrates, and various hard and brittle materials like PZT and TGG.<\/p>\n<p>Offering a choice of<strong> resin and metal base<\/strong> materials to meet various processing needs.<\/p>\n<ul>\n<li>Resin Base: <span style=\"font-weight: 400;\">Suitable for processing hard materials<\/span>.<\/li>\n<li>Metal Base: Provides a longer service life.<\/li>\n<\/ul>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2Welcome to message customer service for price inquiry<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2<\/strong><strong>For custom sizes, please contact customer service.<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2 Preferential discounts can be enjoyed for large orders, please contact customer service.<br \/>\n<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2Please contact customer service for order delivery date:<span style=\"color: #3366ff;\"><a style=\"color: #3366ff;\" href=\"https:\/\/honwaygroup.com\/en\/contact-honway\/\"> Contact Honway<\/a><\/span><\/strong><\/span><\/h5>\n","protected":false},"featured_media":121465,"template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center 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