{"id":122978,"date":"2025-08-01T15:10:28","date_gmt":"2025-08-01T07:10:28","guid":{"rendered":"https:\/\/honwaygroup.com\/product\/hwd25-wafer-eletroplated-dicing-blade\/"},"modified":"2025-08-01T15:10:28","modified_gmt":"2025-08-01T07:10:28","slug":"hwd25-wafer-eletroplated-dicing-blade","status":"publish","type":"product","link":"https:\/\/honwaygroup.com\/en\/product\/hwd25-wafer-eletroplated-dicing-blade\/","title":{"rendered":"HWD25 Wafer Eletroplated Dicing Blade"},"content":{"rendered":"<h1>HWD25 Wafer Eletroplated Dicing Blade<\/h1>\n<h4><strong><span class=\"red\">Honway Materials provide customized services,<\/span><\/strong><\/h4>\n<h4><strong><span class=\"red\">Make the most suitable wafer electroplated dicing blade for you<\/span><\/strong><\/h4>\n<p>&nbsp;<\/p>\n<p>It is suitable for processing semiconductor wafers, packaging substrates and various hard and brittle materials such as LTCC, PZT, TGG, etc.<\/p>\n<h2>Product Features:<\/h2>\n<ul>\n<li data-start=\"85\" data-end=\"151\"><strong>High Precision Machining Capability<\/strong>: Adopts a high-rigidity electroplated structure and strictly controlled blade geometry to ensure a stable and consistent cutting line width, achieving high-precision, high-yield micron-level processing.<\/li>\n<li data-start=\"153\" data-end=\"227\"><strong>Ultra-Narrow Kerf Design<\/strong>: Ultra-narrow kerf width, with a minimum of 10 \u03bcm, meets the dicing needs of high-density layouts and narrow streets on wafers like GaAs LEDs, improving wafer utilization and reducing material loss.<\/li>\n<li data-start=\"229\" data-end=\"262\"><strong>Suitable for Various Wafer Materials<\/strong>: Including monocrystalline silicon, oxide wafers such as silicon dioxide and silicon nitride, and III-V compound semiconductors such as silicon carbide (SiC), gallium arsenide (GaAs), and gallium phosphide (GaP).<\/li>\n<li data-start=\"349\" data-end=\"414\"><strong>Excellent Blade Life and Stability<\/strong>: The blade has excellent chemical stability, effectively resisting corrosion risks in wet or CO\u2082-assisted cutting environments, significantly extending blade life.<\/li>\n<li data-start=\"349\" data-end=\"414\"><strong data-start=\"307\" data-end=\"333\">Ultra-Narrow Diamond Micro-Powder Particle Size Distribution, Paired with Highly Consistent Crystal Shape Selection<\/strong>: Carefully selected high-compactness diamond crystal shapes with a uniform particle size distribution ensure the cleanliness of the machined surface and cutting stability, improving finished product yield.<\/li>\n<li data-start=\"349\" data-end=\"414\"><strong data-start=\"540\" data-end=\"554\">High Blade Strength and Rigidity Design<\/strong>: Suitable for high-speed operation environments, it can effectively prevent offset phenomena like &#8220;snake marks&#8221; during cutting, while ensuring good perpendicularity and neatness of the die sidewalls.<\/li>\n<li data-start=\"416\" data-end=\"473\"><strong>Customizable Blade Specifications<\/strong>: Provides different blade thicknesses, outer diameters, blade shapes, and metal matrix hardness to meet various wafer sizes and cutting needs.<\/li>\n<\/ul>\n<h2>Uses:<\/h2>\n<ul>\n<li>Suitable for cutting or grooving, especially for wafer dicing and semiconductor packaging.<\/li>\n<li>Used during the semiconductor wafer dicing process stage.<\/li>\n<\/ul>\n<h2>Application areas:<\/h2>\n<ul>\n<li>Suitable for the precision cutting and processing of silicon wafers, oxide wafers, and various compound wafers such as silicon carbide (SiC), gallium arsenide (GaAs), and gallium phosphide (GaP).<\/li>\n<li>Composite silicon wafers, electronic materials, resins, metals, ceramics, composite materials, etc.<\/li>\n<\/ul>\n<h4><strong>Please specify the following when ordering dicing blades:<\/strong><\/h4>\n<ul>\n<li>Shape and dimensions of the dicing blade:<\/li>\n<li><span style=\"font-weight: 400;\">Blade protrusion amount (um): For example, Z(250-380)<\/span><\/li>\n<li>Kerf width: For example, A(16-20)<\/li>\n<li>Grit size: For example, #1800<\/li>\n<li>Bond type: For example, <span style=\"font-weight: 400;\">N general-purpose<\/span><\/li>\n<li>Concentration: For example, 90<\/li>\n<li>Use: For silicon carbide (SiC), gallium arsenide (GaAs), gallium phosphide wafers<\/li>\n<li>Quantity and delivery time:<\/li>\n<li>RPM and processing conditions:<\/li>\n<li>Processing equipment model:<\/li>\n<li>Most manufacturers mark the following information on the dicing blades, with a specification example: CB 3000N70<\/li>\n<\/ul>\n<table>\n<tbody>\n<tr>\n<td><strong>Blade Exposure (\u00b5m)<\/strong><\/td>\n<td><strong>Kerf Width (\u00b5m)<\/strong><\/td>\n<td><strong>Particle Size<\/strong><\/td>\n<td><strong>Binder<\/strong><\/td>\n<td><strong>Concentration (Volume)<\/strong><\/td>\n<\/tr>\n<tr>\n<td><span style=\"font-weight: 400;\">Z 250-380<\/span><\/p>\n<p><span style=\"font-weight: 400;\">A 385-510<\/span><\/p>\n<p><span style=\"font-weight: 400;\">B 510-640<\/span><\/p>\n<p><span style=\"font-weight: 400;\">C 640-760<\/span><\/p>\n<p><span style=\"font-weight: 400;\">D 760-890<\/span><\/p>\n<p><span style=\"font-weight: 400;\">E 890-1020<\/span><\/p>\n<p><span style=\"font-weight: 400;\">F 1020-1150<\/span><\/p>\n<p><span style=\"font-weight: 400;\">G 1150-1270<\/span><\/td>\n<td><span style=\"font-weight: 400;\">Z 11-15<\/span><\/p>\n<p><span style=\"font-weight: 400;\">A 16-20<\/span><\/p>\n<p><span style=\"font-weight: 400;\">B 20-25<\/span><\/p>\n<p><span style=\"font-weight: 400;\">C 25-30<\/span><\/p>\n<p><span style=\"font-weight: 400;\">D 30-35<\/span><\/p>\n<p><span style=\"font-weight: 400;\">E 35-40<\/span><\/p>\n<p><span style=\"font-weight: 400;\">F 40-50<\/span><\/p>\n<p><span style=\"font-weight: 400;\">G 50-60<\/span><\/td>\n<td><span style=\"font-weight: 400;\">#1000<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#1500<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#1700<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#1800<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#2000<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#2500<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#3000<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#3500<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#4000<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#4500<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#4800<\/span><\/p>\n<p><span style=\"font-weight: 400;\">#5000<\/span><\/td>\n<td><span style=\"font-weight: 400;\">S Sharp Type<\/span><\/p>\n<p><span style=\"font-weight: 400;\">N General Type<\/span><\/p>\n<p><span style=\"font-weight: 400;\">H High Strength Type<\/span><\/td>\n<td><span style=\"font-weight: 400;\">50<\/span><\/p>\n<p><span style=\"font-weight: 400;\">70<\/span><\/p>\n<p><span style=\"font-weight: 400;\">90<\/span><\/p>\n<p><span style=\"font-weight: 400;\">110<\/span><\/p>\n<p><span style=\"font-weight: 400;\">130<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h2>Sample images:<\/h2>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/04\/1A1.jpg\"><img fetchpriority=\"high\" decoding=\"async\" class=\"size-full wp-image-93178 aligncenter\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/04\/1A1.jpg\" alt=\"\" width=\"520\" height=\"198\"><\/a><\/p>\n<p>&nbsp;<\/p>\n<h2>Product technical advantages:<\/h2>\n<p>Carefully selected high-compactness diamond crystal shapes and uniform particle size distribution ensure the cleanliness of the machined surface and cutting stability, improving finished product yield.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%871.avif\"><img decoding=\"async\" class=\"alignnone wp-image-121156 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%871.avif\" alt=\"\" width=\"495\" height=\"330\"><\/a><\/p>\n<p>By precisely controlling the diamond concentration, the HWD25 series effectively balances processing stability and tool life, showing excellent performance in reducing wafer backside chipping to achieve high-yield, high-reliability cutting results.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%873.avif\"><img decoding=\"async\" class=\"alignnone wp-image-121165 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%873.avif\" alt=\"\" width=\"467\" height=\"325\"><\/a><\/p>\n<p>The high-precision process can reduce adjustment and pre-calibration time before cutting, while effectively reducing blade runout and vibration during high-speed operation, enhancing machine stability.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%874.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121174 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%874.avif\" alt=\"\" width=\"476\" height=\"327\"><\/a><\/p>\n<p>The blade possesses excellent chemical stability, effectively resisting corrosion risks in wet or CO\u2082-assisted cutting environments, significantly extending blade life.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-02.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121355\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-02.avif\" alt=\"\" width=\"467\" height=\"323\"><\/a><\/p>\n<p><strong data-start=\"465\" data-end=\"486\">The ultra-narrow kerf width, with a minimum of 10 \u03bcm<\/strong>, meets the dicing needs of high-density layouts and narrow street wafers like GaAs LEDs, improving wafer utilization and reducing material loss.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%876.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121192 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%876.avif\" alt=\"\" width=\"467\" height=\"338\"><\/a><\/p>\n<p>Suitable for high-speed operation environments, it can effectively prevent offset phenomena like &#8220;snake mark.<\/p>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%877.avif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121201 size-full\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E5%9C%96%E7%89%877.avif\" alt=\"\" width=\"501\" height=\"332\"><\/a><\/p>\n<h2>Use Case:<\/h2>\n<p><a href=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-03.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-121366\" src=\"https:\/\/honwaygroup.com\/wp-content\/uploads\/2025\/08\/%E6%95%B8%E6%93%9A%E5%9C%96-03.jpg\" alt=\"\" width=\"635\" height=\"187\"><\/a><\/p>\n<p>8-inch IC silicon wafer, cutting path contains metal, no laser burn.<\/p>\n<h2>Precautions:<\/h2>\n<ul>\n<li><b>Check the Dicing Blade<\/b>: Before installation, be sure to carefully inspect the dicing blade for cracks or chips. If damage is found, stop using it immediately to prevent danger.<\/li>\n<li><b>Confirm Rotation Direction<\/b>: Ensure that the rotation direction mark on the dicing blade matches the actual rotation direction of the machine&#8217;s spindle. Using it in reverse will affect the cutting effect and blade life.<\/li>\n<li><b>Use the Correct Blade<\/b>: Only use dicing blades that meet the specifications of the machine tool and processing conditions, avoiding processing failure or equipment damage due to non-compliant specifications.<\/li>\n<li><b>Immediate Shutdown<\/b>: During the processing, if abnormal sounds, vibrations, or non-smooth cutting occurs, immediately stop the machine&#8217;s operation and find the cause before continuing.<\/li>\n<li><b>Regular Dressing<\/b>: When you find that the cutting efficiency decreases, you should dress the blade. Continuing to use a dull blade may lead to overheating, overload, or even breakage.<\/li>\n<li><b>Do Not Touch<\/b>: When the dicing blade is rotating, it is strictly forbidden to touch it with your hands or other body parts to avoid personal injury.<\/li>\n<\/ul>\n<p><span style=\"font-size: 16px;\">Any questions? <\/span><a style=\"font-size: 16px; background-color: #ffffff;\" href=\"https:\/\/honwaygroup.com\/en\/contact-honway\/\" target=\"_blank\" rel=\"nofollow noopener\">Contact HonWay<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<ul>\n<li>Suitable for the precision cutting and processing of silicon wafers, oxide wafers, and various compound wafers such as silicon carbide (SiC), gallium arsenide (GaAs), and gallium phosphide (GaP).<\/li>\n<li>Composite silicon wafers, electronic materials, resins, metals, ceramics, composite materials, etc.<\/li>\n<li>Suitable for cutting or grooving, especially for wafer dicing and semiconductor packaging.<\/li>\n<li>Used during the semiconductor wafer dicing process stage.<\/li>\n<\/ul>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2Welcome to message customer service for price inquiry<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2<\/strong><strong>For custom sizes, please contact customer service.<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2 Preferential discounts can be enjoyed for large orders, please contact customer service.<br \/>\n<\/strong><\/span><\/h5>\n<h5><span style=\"color: #ff0000;\"><strong>\u25b2Please contact customer service for order delivery date:<span style=\"color: #3366ff;\"><a style=\"color: #3366ff;\" href=\"https:\/\/honwaygroup.com\/en\/contact-honway\/\"> Contact Honway<\/a><\/span><\/strong><\/span><\/h5>\n","protected":false},"featured_media":121387,"template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center 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